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 MAX809, MAX810
3-Pin Microprocessor Reset Monitors
The MAX809 and MAX810 are cost-effective system supervisor circuits designed to monitor VCC in digital systems and provide a reset signal to the host processor when necessary. No external components are required. The reset output is driven active within 20 sec of VCC falling through the reset voltage threshold. Reset is maintained active for a minimum of 140msec after VCC rises above the reset threshold. The MAX810 has an active-high RESET output while the MAX809 has an active-low RESET output. The output of the MAX809 is guaranteed valid down to VCC = 1V. Both devices are available in a SOT-23 package. The MAX809/810 are optimized to reject fast transient glitches on the VCC line. Low supply current of 17A (VCC = 3.3V) makes these devices suitable for battery powered applications.
SOT-23 (TO-236) CASE 318
* Precision VCC Monitor for 3.0V, 3.3V, and 5.0V Supplies * 140msec Guaranteed Minimum RESET, RESET * * * * * *
Output Duration RESET Output Guaranteed to VCC = 1.0V (MAX809) Low 17A Supply Current VCC Transient Immunity Small SOT-23 Package No External Components Wide Operating Temperature: -40C to 85C
Features
PIN CONFIGURATION (Top View)
GND
1
3 RESET (RESET)**
VCC
2
SOT-23*
NOTE: *SOT-23 is equivalent to JEDEC (TO-236) ** RESET is for MAX809 ** RESET is for MAX810
Typical Applications * Computers * Embedded Systems * Battery Powered Equipment * Critical P Power Supply Monitoring
TYPICAL APPLICATION DIAGRAM
VCC VCC MAX809 RESET VCC PROCESSOR RESET INPUT GND
ORDERING INFORMATION
Device MAX809xTR MAX810xTR Package SOT-23 SOT-23 Shipping 3000 Tape/Reel 3000 Tape/Reel
NOTE: The "x" denotes a suffix for VCC threshold - see table below Suffix L M J* T S R Reset VCC Threshold (V) 4.63 4.38 4.00 3.08 2.93 2.63
GND
NOTE: *J version is available for MAX809 only
1
MAX809, MAX810
MAX809, MAX810
ABSOLUTE MAXIMUM RATINGS*
Symbol Parameter Supply Voltage (VCC to GND) RESET, RESET Input Current, VCC Output Current, RESET, RESET dV/dt (VCC) PD TA Tstg Tsol Power Dissipation (TA 70C) SOT-23 (derate 4mW/C above +70C) Operating Temperature Range Storage Temperature Range Lead Temperature (Soldering, 10 Seconds) Value 6.0 -0.3 to (VCC + 0.3) 20 20 100 230 -40 to +85 -65 to +150 +260 C C C Unit V V mA mA V/sec mW
* Maximum Ratings are those values beyond which damage to the device may occur.
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MAX809, MAX810
MAX809, MAX810
ELECTRICAL CHARACTERISTICS (VCC = Full Range, TA = -40C to +85C unless otherwise noted. typical values are at TA = +25C, VCC = 5V for L/M/J, 3.3V for T/S, 3.0V for R) (Note NO TAG)
Symbol VCC Range TA = 0C to +70C TA = -40C to +85C ICC Supply Current MAX8xxL/M/J: VCC < 5.5V MAX8xxR/S/T: VCC < 3.6V Reset Threshold (Note NO TAG) MAX8xxL: TA = 25C TA = -40C to +85C MAX8xxM: TA = 25C TA = -40C to +85C MAX809J: TA = 25C TA = -40C to +85C MAX8xxT: TA = 25C TA = -40C to +85C MAX8xxS: TA = 25C TA = -40C to +85C MAX8xxR: TA = 25C TA = -40C to +85C Reset Threshold Temperature Coefficient VCC to Reset Delay VCC = VTH to (VTH - 100mV) Reset Active Timeout Period VOL RESET Output Voltage Low (MAX809) MAX809R/S/T: VCC = VTH min, ISINK = 1.2mA MAX809L/M/J: VCC = VTH min, ISINK = 3.2mA VCC > 1.0V, ISINK = 50A RESET Output Voltage High (MAX809) MAX809R/S/T: VCC > VTH max, ISOURCE = 500A MAX809L/M/J: VCC > VTH max, ISOURCE = 800A RESET Output Voltage Low (MAX810) MAX810R/S/T: VCC = VTH max, ISINK = 1.2mA MAX810L/M/J: VCC = VTH max, ISINK = 3.2mA RESET Output Voltage High (MAX810) 1.8 < VCC < VTH min, ISOURCE = 150A Characteristic Min 1.0 1.2 -- -- 4.56 4.50 4.31 4.25 3.93 3.89 3.04 3.00 2.89 2.85 2.59 2.55 -- -- 140 -- -- -- 0.8 VCC VCC - 1.5 -- -- 0.8 VCC Typ -- -- 24 17 4.63 -- 4.38 -- 4.00 -- 3.08 -- 2.93 -- 2.63 -- 30 20 240 -- -- -- -- -- -- -- -- Max 5.5 5.5 A 60 50 V 4.70 4.75 4.45 4.50 4.06 4.10 3.11 3.15 2.96 3.00 2.66 2.70 -- -- 560 0.3 0.4 0.3 V -- -- V 0.3 0.4 V -- ppm/C sec msec V Unit V
VTH
VOH
VOL
VOH
1. Production testing done at TA = 25C, over temperature limits guaranteed by design.
PIN DESCRIPTION
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1 2 2 3 GND Ground RESET (MAX809) RESET output remains low while VCC is below the reset voltage threshold, and for 240msec (typ.) after VCC rises above reset threshold RESET (MAX810) VCC RESET output remains high while VCC is below the reset voltage threshold, and for 240msec (typ.) after VCC rises above reset threshold Supply Voltage (typ.) 3
Pin No.
Symbol
Description
MAX809, MAX810
MAX809, MAX810
APPLICATIONS INFORMATION
VCC Transient Rejection
The MAX809/810 provides accurate VCC monitoring and reset timing during power-up, power-down, and brownout/sag conditions, and rejects negative-going transients (glitches) on the power supply line. Figure 1 shows the maximum transient duration vs. maximum negative excursion (overdrive) for glitch rejection. Any combination of duration and overdrive which lies under the curve will not generate a reset signal. Combinations above the curve are detected as a brownout or power-down. Transient immunity can be improved by adding a capacitor in close proximity to the VCC pin of the MAX809/810.
VCC VTH Overdrive
hold the output low (Figure 2). This resistor value, though not critical, should be chosen such that it does not appreciably load RESET under normal operation (100kW will be suitable for most applications). Similarly, a pull-up resistor to VCC is required for the MAX810 to ensure a valid high RESET for VCC below 1.0V.
VCC
VCC MAX809 RESET R1 100 k
GND
Duration MAXIMUM TRANSIENT DURATION ( m sec) 400 TA = +25 C
Figure 2. Ensuring RESET Valid to VCC = 0 V Processors With Bidirectional I/O Pins
320 240 160 MAX8xxL/M/J 90 0 1 MAX8xxR/S/T 10 100 1000 RESET COMPARATOR OVERDRIVE, (VTH - VCC (mV)
Some P's (such as Motorola 68HC11) have bi-directional reset pins. Depending on the current drive capability of the processor pin, an indeterminate logic level may result if there is a logic conflict. This can be avoided by adding a 4.7kW resistor in series with the output of the MAX809/810 (Figure 3). If there are other components in the system which require a reset signal, they should be buffered so as not to load the reset line. If the other components are required to follow the reset I/O of the P, the buffer should be connected as shown with the solid line.
BUFFER
VCC
Figure 1. Maximum Transient Duration vs. Overdrive for Glitch Rejection at 25 C RESET Signal Integrity During Power-Down
BUFFERED RESET TO OTHER SYSTEM COMPONENTS VCC 47 k RESET
VCC MAX809
mP
The MAX809 RESET output is valid to VCC = 1.0V. Below this voltage the output becomes an "open circuit" and does not sink current. This means CMOS logic inputs to the P will be floating at an undetermined voltage. Most digital systems are completely shutdown well above this voltage. However, in situations where RESET must be maintained valid to VCC = 0V, a pull-down resistor must be connected from RESET to ground to discharge stray capacitances and
RESET GND
GND
Figure 3. Interfacing to Bidirectional Reset I/O
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MAX809, MAX810
MAX809, MAX810
TYPICAL CHARACTERISTICS
35 30 SUPPLY CURRENT ( mA) 25 20 15 10 5 0 -40 VCC = 1 V VCC = 3 V VCC = 5 V SUPPLY CURRENT ( mA) 30 VCC = 5 V 25 20 15 10 5 0 -40 VCC = 1 V VCC = 3 V
-20
0 20 40 TEMPERATURE (C)
60
85
-20
0 20 40 TEMPERATURE (C)
60
85
Figure 4. Supply Current vs Temperature (No Load, MAX8xxR/S/T)
Figure 5. Supply Current vs Temperature (No Load, MAX8xxL/M/J/)
100 POWER-DOWN RESET DELAY ( m sec) 80 60 40 20 0 -40
POWER-DOWN RESET DELAY ( m sec)
VOD = VTH - VCC VOD = 10 mV
140 VOD = VTH - VCC 120 VOD = 10 mV 100 80 60 40 20 0 -40 VOD = 200 mV -20 0 20 40 TEMPERATURE (C) 60 85 VOD = 100 mV VOD = 20 mV
VOD = 10 mV
VOD = 100 mV VOD = 200 mV -20 0 20 40 TEMPERATURE (C) 60 85
Figure 6. Power-Down Reset Delay vs Temperature and Overdrive (MAX8xxR/S/T)
Figure 7. Power-Down Reset Delay vs Temperature and Overdrive (MAX8xxL/M/J)
POWER-UP RESET TIMEOUT (msec)
250 NORMALIZED THRESHOLD 245 MAX8xxL/M/J 240 235 230 225 -40 MAX8xxR/S/T
1.003 1.002 1.001 1.000 0.999 0.998 0.997
-20
0 20 40 TEMPERATURE (C)
60
85
-40
-20
0 20 40 TEMPERATURE (C)
60
85
Figure 8. Power-Up Reset Timeout vs Temperature
Figure 9. Normalized Reset Threshold vs Temperature
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YW = Date code
MARKING DIAGRAM
TAPING FORM
MARKING
MAX810R
MAX810S
MAX810T
MAX810M
MAX810L
MAX809J
MAX809R
MAX809S
MAX809T
MAX809M
MAX809L
ON Semiconductor Part #
Tape & Reel Specifications Table
Package
SOT-23
x
YW = Date Code
Component Taping Orientation for 3L SOT-23 (JEDEC-236) Devices
x
SOT-23
PIN 1
Y
DEVICE MARKING
Carrier Width (W)
W
8 mm
Standard Reel Component Orientation (Mark Right Side Up)
Reset Threshold or Address
MAX809, MAX810
USER DIRECTION OF FEED
2.63
2.93
3.08
4.38
4.63
4.00
2.63
2.93
3.08
4.38
4.63
Pitch (P)
4 mm
6
Part Per Full Reel
3000
MAX809, MAX810
Reel Size
7 inches
Marking
K5YW K4YW K3YW K2YW K1YW J6YW J5YW J4YW J3YW J2YW J1YW
MAX809, MAX810
MAX809, MAX810
PACKAGE DIMENSIONS
SOT-23 PLASTIC PACKAGE (TO-236) CASE 318-08 ISSUE AF
NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: INCH. 3. MAXIMUM LEAD THICKNESS INCLUDES LEAD FINISH THICKNESS. MINIMUM LEAD THICKNESS IS THE MINIMUM THICKNESS OF BASE MATERIAL.
A L
3
BS
1 2
V
G C D H K J
DIM A B C D G H J K L S V
INCHES MIN MAX 0.1102 0.1197 0.0472 0.0551 0.0350 0.0440 0.0150 0.0200 0.0701 0.0807 0.0005 0.0040 0.0034 0.0070 0.0140 0.0285 0.0350 0.0401 0.0830 0.1039 0.0177 0.0236
MILLIMETERS MIN MAX 2.80 3.04 1.20 1.40 0.89 1.11 0.37 0.50 1.78 2.04 0.013 0.100 0.085 0.177 0.35 0.69 0.89 1.02 2.10 2.64 0.45 0.60
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